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| RFG50N06, RFP50N06, RF1S50N06SM Data Sheet July 1999 File Number 3575.4 50A, 60V, 0.022 Ohm, N-Channel Power MOSFETs These N-Channel power MOSFETs are manufactured using the MegaFET process. This process, which uses feature sizes approaching those of LSI integrated circuits gives optimum utilization of silicon, resulting in outstanding performance. They were designed for use in applications such as switching regulators, switching converters, motor drivers, and relay drivers. These transistors can be operated directly from integrated circuits. Formerly developmental type TA49018. Features * 50A, 60V * rDS(ON) = 0.022 * Temperature Compensating PSPICE(R) Model * Peak Current vs Pulse Width Curve * UIS Rating Curve * 175oC Operating Temperature Symbol D Ordering Information PART NUMBER RFG50N06 RFP50N06 RF1S50N06SM PACKAGE TO-247 TO-220AB TO-263AB BRAND RFG50N06 RFP50N06 F1S50N06 S G NOTE: When ordering, use the entire part number. Add the suffix, 9A, to obtain the TO-263AB variant in tape and reel, i.e. RF1S50N06SM9A. Packaging JEDEC STYLE TO-247 SOURCE DRAIN GATE DRAIN (BOTTOM SIDE METAL) DRAIN (FLANGE) JEDEC TO-220AB SOURCE DRAIN GATE JEDEC TO-263AB DRAIN (FLANGE) GATE SOURCE 4-467 CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures. PSPICE(R) is a registered trademark of MicroSim Corporation. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999 RFG50N06, RFP50N06, RF1S50N06SM Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified RFG50N06, RFP50N06 RF1S50N06SM 60 60 20 50 (Figure 5) (Figure 6, 14, 15) 131 0.877 -55 to 175 300 260 UNITS V V V A Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Continuous Drain Current (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, see Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg W W/oC oC oC oC CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. TJ = 25oC to 150oC. Electrical Specifications PARAMETER TC = 25oC, Unless Otherwise Specified SYMBOL BVDSS VGS(TH) IDSS TEST CONDITIONS ID = 250A, VGS = 0V (Figure 11) VGS = VDS, ID = 250A (Figure 10) VDS = 60V, VGS = 0V VGS = 20V ID = 50A, VGS = 10V (Figures 9) VDD = 30V, ID = 50A RL = 0.6, VGS = 10V RGS = 3.6 (Figure 13) TC = 25oC TC = 150oC MIN 60 2 VGS = 0 to 20V VGS = 0 to 10V VGS = 0 to 2V VDD = 48V, ID = 50A, RL = 0.96 Ig(REF) = 1.45mA (Figure 13) (Figure 3) TO-247 TO-220, TO-263 TYP 12 55 37 13 125 67 3.7 2020 600 200 MAX 4 1 50 100 0.022 95 75 150 80 4.5 1.14 30 62 UNITS V V A A nA ns ns ns ns ns ns nC nC nC pF pF pF oC/W oC/W oC/W Drain to Source Breakdown Voltage Gate to Source Threshold Voltage Zero Gate Voltage Drain Current Gate to Source Leakage Current Drain to Source On Resistance Turn-On Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-Off Time Total Gate Charge Gate Charge at 10V Threshold Gate Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient IGSS rDS(ON) tON td(ON) tr td(OFF) tf tOFF Qg(TOT) Qg(10) Qg(TH) CISS COSS CRSS RJC RJA VDS = 25V, VGS = 0V f = 1MHz (Figure 12) Source to Drain Diode Specifications PARAMETER Source to Drain Diode Voltage Reverse Recovery Time SYMBOL VSD trr ISD = 50A ISD = 50A, dISD/dt = 100A/s TEST CONDITIONS MIN TYP MAX 1.5 125 UNITS V ns 4-468 RFG50N06, RFP50N06, RF1S50N06SM Typical Performance Curves 1.2 POWER DISSIPATION MULTIPLIER 1.0 ID , DRAIN CURRENT (A) 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 TC , CASE TEMPERATURE (oC) 150 175 Unless Otherwise Specified 60 50 40 30 20 10 0 25 50 75 100 125 150 175 TC , CASE TEMPERATURE (oC) FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE TEMPERATURE FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs CASE TEMPERATURE 2 1 THERMAL IMPEDANCE 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 -5 10 10-4 10-3 10-2 10-1 t1 , RECTANGULAR PULSE DURATION (s) t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC 100 101 t1 PDM ZJC, NORMALIZED FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE 400 TJ = MAX RATED SINGLE PULSE TC = 25oC IDM , PEAK CURRENT (A) 103 FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT CAPABILITY AS FOLLOWS: VGS = 20V 175 - T C I = I 25 ----------------------- 150 ID , DRAIN CURRENT (A) 100 100s 1ms 10 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) VDSS(MAX) = 60V 1 10 VDS , DRAIN TO SOURCE VOLTAGE (V) 10ms 100ms DC 100 VGS = 10V 102 TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION 40 10-3 10-2 10-1 100 101 102 t, PULSE WIDTH (ms) 103 104 TC = 25oC 1 FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY 4-469 RFG50N06, RFP50N06, RF1S50N06SM Typical Performance Curves 300 IAS, AVALANCHE CURRENT (A) Unless Otherwise Specified (Continued) 125 VGS = 10V STARTING TJ = 25oC ID , DRAIN CURRENT (A) 100 100 VGS = 8V PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX TC = 25oC VGS = 7V 75 10 STARTING TJ = 150oC If R = 0 tAV = (L) (IAS) / (1.3 RATED BVDSS - VDD) 50 VGS = 6V VGS = 5V VGS = 4V 25 1 0.01 If R 0 tAV = (L/R) ln [(IAS*R) / (1.3 RATED BVDSS - VDD) + 1] 0.1 1 10 0 0 1.5 3.0 4.5 6.0 7.5 VDS , DRAIN TO SOURCE VOLTAGE (V) tAV, TIME IN AVALANCHE (ms) NOTE: Refer to Intersil Application Notes 9321 and 9322. FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY FIGURE 7. SATURATION CHARACTERISTICS 125 NORMALIZED DRAIN TO SOURCE ON RESISTANCE ID, DRAIN CURRENT (A) 100 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VDD = 15V -55oC 25oC 2.5 2.0 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = 10V, ID = 50A 175oC 75 1.5 50 1.0 25 0.5 0 0 1 2 3 4 5 6 7 8 9 10 VGS , GATE TO SOURCE VOLTAGE (V) 0 -80 -40 0 40 80 120 160 200 TJ , JUNCTION TEMPERATURE (oC) FIGURE 8. TRANSFER CHARACTERISTICS FIGURE 9. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE 2.0 NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE VGS = VDS, ID = 250A NORMALIZED GATE THRESHOLD VOLTAGE 1.5 2.0 ID = 250A 1.5 1.0 1.0 0.5 0.5 0 -80 -40 0 40 80 120 160 200 0 -80 -40 0 40 80 120 160 200 TJ , JUNCTION TEMPERATURE (oC) TJ , JUNCTION TEMPERATURE (oC) FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE vs JUNCTION TEMPERATURE 4-470 RFG50N06, RFP50N06, RF1S50N06SM Typical Performance Curves 4000 VDS , DRAIN TO SOURCE VOLTAGE (V) VGS = 0V, f = 1MHz CISS = CGS + CGD CRSS = CGD COSS = CDS + CGD CISS 2000 Unless Otherwise Specified (Continued) 60 VDD = BVDSS 45 VDD = BVDSS 7.5 10 VGS , GATE TO SOURCE VOLTAGE (V) C, CAPACITANCE (pF) 3000 30 0.75 BVDSS 0.50 BVDSS 15 0.75 BVDSS 0.50 BVDSS 5.0 1000 COSS CRSS 0.25 BVDSS 0.25 BVDSS RL = 1.2 Ig(REF) = 1.45mA VGS = 10V 20 Ig(REF) Ig(ACT) t, TIME (s) 80 Ig(REF) Ig(ACT) 2.5 0 0 5 10 15 20 25 VDS , DRAIN TO SOURCE VOLTAGE (V) 0 0 NOTE: Refer to Intersil Application Notes AN7254 and AN7260. FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE FIGURE 13. NORMALIZED SWITCHING WAVEFORMS FOR CONSTANT GATE CURRENT Test Circuits and Waveforms VDS BVDSS L VARY tP TO OBTAIN REQUIRED PEAK IAS VGS DUT tP RG IAS VDD tP VDS VDD + 0V IAS 0.01 0 tAV FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT FIGURE 15. UNCLAMPED ENERGY WAVEFORMS tON VDS VDS VGS RL + tOFF td(OFF) tr tf 90% td(ON) 90% DUT RGS VGS - VDD 0 10% 90% 10% VGS 0 10% 50% PULSE WIDTH 50% FIGURE 16. SWITCHING TIME TEST CIRCUIT FIGURE 17. SWITCHING WAVEFORMS 4-471 RFG50N06, RFP50N06, RF1S50N06SM Test Circuits and Waveforms VDS RL VDD VDS VGS = 20V VGS + (Continued) Qg(TOT) Qg(10) VDD VGS VGS = 2V 0 Qg(TH) Ig(REF) 0 VGS = 10V DUT Ig(REF) FIGURE 18. GATE CHARGE TEST CIRCUIT FIGURE 19. GATE CHARGE WAVEFORMS 4-472 RFG50N06, RFP50N06, RF1S50N06SM PSPICE Electrical Model .SUBCKT RFP50N06 2 1 3 REV 2/22/93 *NOM TEMP = 25oC CA 12 8 3.68e-9 CB 15 14 3.625e-9 CIN 6 8 1.98e-9 5 DBODY 7 5 DBDMOD DBREAK 5 11DBKMOD DPLCAP 10 5 DPLCAPMOD EBREAK 11 7 17 18 64.59 EDS 14 8 5 8 1 EGS 13 8 6 8 1 ESG 6 10 6 8 1 EVTO 20 6 18 8 1 IT 8 17 1 10 ESG + GATE 1 LGATE 9 20 RGATE EVTO + 18 8 6 8 DPLCAP 16 RDRAIN DBREAK DRAIN 2 LDRAIN 6 VTO + MOS2 21 MOS1 11 17 EBREAK 18 RSOURCE + DBODY RIN CIN 8 7 LSOURCE 3 SOURCE 18 RVTO S1A S2A 14 13 S2B 13 CB 14 + 5 EDS 8 IT 15 17 RBREAK LDRAIN 2 5 1e-9 LGATE 1 9 5.65e-9 LSOURCE 3 7 4.13e-9 MOS1 16 6 8 8 MOSMOD M=0.99 MOS2 16 21 8 8 MOSMOD M=0.01 RBREAK 17 18 RBKMOD 1 RDRAIN 5 16 RDSMOD 1e-4 RGATE 9 20 0.690 RIN 6 8 1e9 RSOURCE 8 7 RDSMOD 12e-3 RVTO 18 19 RVTOMOD 1 S1A 6 12 13 8 S1AMOD S1B 13 12 13 8 S1BMOD S2A 6 15 14 13 S2AMOD S2B 13 15 14 13 S2BMOD VBAT 8 19 DC 1 VTO 21 6 0.678 CA 12 13 8 S1B 19 VBAT + + EGS 6 -8 - - .MODEL DBDMOD D (IS=9.85e-13 RS=4.91e-3 TRS1=2.07e-3 TRS2=2.51e-7 CJO=2.05e-9 TT=4.33e-8) .MODEL DBKMOD D (RS=1.98e-1 TRS1=2.35E-4 TRS2=-3.83e-6) .MODEL DPLCAPMOD D (CJO=1.42e-9 IS=1e-30 N=10) .MODEL MOSMOD NMOS (VTO=3.65 KP=35 IS=1e-30 N=10 TOX=1 L=1u W=1u) .MODEL RBKMOD RES (TC1=1.23e-3 TC2=-2.34e-7) .MODEL RDSMOD RES (TC1=5.01e-3 TC2=1.49e-5) .MODEL RVTOMOD RES (TC1=-5.03e-3 TC2=-5.16e-6) .MODEL S1AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-6.75 VOFF=-2.5) .MODEL S1BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-2.5 VOFF=-6.75) .MODEL S2AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-2.7 VOFF=2.3) .MODEL S2BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=2.3 VOFF=-2.7) .ENDS NOTE: For further discussion of the PSPICE model consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; authors, William J. Hepp and C. Frank Wheatley. 4-473 RFG50N06, RFP50N06, RF1S50N06SM All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029 4-474 |
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